Wiring substrate

Details Wiring substrate Wiring substrate

2005-01-11

2005-01-11

Pham, Long (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

C257S737000, C257S738000, C257S766000, C257S703000, C257S772000

Reexamination Certificate

active

06841885

ABSTRACT:
An object of the invention is to prevent the color on a surface of a plated metal layer from changing. The invention is a wiring substrate obtained by forming a wiring conductor made of a metal having a high melting point on an insulator, and coating a surface of the wiring conductor with an electroless plated metal layer, wherein the electroless plated metal layer contains an element of Group 1B and is free from lead.

REFERENCES:
patent: 5838069 (1998-11-01), Itai et al.
patent: 2-104671 (1990-04-01), None
patent: 4-349690 (1992-12-01), None
patent: 10-135606 (1998-05-01), None
patent: 2000195989 (2000-07-01), None

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