4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Lead frame

Yoshiaki Emoto

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Flexible substrate with projections to block resin flow

Stock material or miscellaneous articles – Structurally defined web or sheet – Including variation in thickness
Patent

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Flexible tape carrier with external terminals formed on...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Flexible tape carrier with external terminals formed on...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Lead frame and a semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent

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Method of bonding metals, and method and apparatus for producing

Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler
Patent

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Profile ID: LFUS-PAI-P-212191

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