Method of bonding metals, and method and apparatus for producing

Details Method of bonding metals, and method and apparatus for producing Method of bonding metals, and method and apparatus for producing

1990-04-26

1992-02-25

Ramsey, Kenneth J.

Metal fusion bonding

Process

Metal to nonmetal with separate metallic filler

228 62, 228 47, 228124, 2281802, H01L 2158

Patent

active

050906097

ABSTRACT:
An invention relating to a technique for producing a chip mount type package or a TAB package with high reliability, without use of a flux which would cause environmental pollution or would hinder an enhancement of reliability, and more particularly pertaining to a method of irradiating bonding surfaces, for which a solder is used, and solder bump electrodes of a package with an atomic or ion energy beam and bonding the bonding surfaces to each other under normal pressure (about 1 atm) in a continuous apparatus.

REFERENCES:
patent: 4166563 (1979-09-01), Peyraud et al.
patent: 4245768 (1981-01-01), Sater
patent: 4247034 (1981-01-01), Burkart et al.
Yosetsu Gijyutsu, Jul., 1987, pp. 88-91.

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