Stock material or miscellaneous articles – Structurally defined web or sheet – Including variation in thickness
Patent
1993-12-10
1995-06-06
Watkins, III, William P.
Stock material or miscellaneous articles
Structurally defined web or sheet
Including variation in thickness
428131, 428137, 428157, 428172, 4284735, 428458, 428195, 428209, 428 99, 428906, 206330, 206331, 437207, 437219, 257666, 257667, H01L 2156
Patent
active
054221633
ABSTRACT:
A flexible substrate to be used for assemblage of a semiconductor chip having connecting points to be electrically connected to an external side, comprises a base film unit made of a flexible synthetic resin and including a mounting portion for mounting thereon a semiconductor chip, groups of conductive leads formed on a surface of the base film unit, each lead group including a plurality of the leads formed so as to extend from respective positions in the mounting portion corresponding to the connecting points of the semiconductor chip as mounted in the mounting portion to selected positions on the base film unit, and a plurality of projections each formed at an area between adjacent two of the lead groups on the surface of the base film unit and having a height substantially equal to the height of the leads of the lead group.
REFERENCES:
patent: 3689991 (1972-09-01), Aird
patent: 4763407 (1987-08-01), Abe
patent: 5031022 (1990-07-01), Yamamoto et al.
patent: 5064706 (1991-11-01), Ueda et al.
patent: 5137479 (1992-08-01), Ohikata et al.
patent: 5177591 (1993-01-01), Emanuel
Emoto Yoshiaki
Kamiyama Tadashi
Nippon Steel Corporation
Watkins III William P.
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