Lead frame and a semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

257676, H01L 23495

Patent

active

061181730

ABSTRACT:
A semiconductor device of this invention includes a semiconductor chip on which a device is formed, inner leads reaching the periphery of the semiconductor chip, and bonding wires for electrically connecting the semiconductor chip and the inner leads. The semiconductor chip is fixed on a die pad portion, and a chip fixing inner lead is integrated with the die pad portion. To simplify the bonding wire connection process and improve the reliability, the chip fixing inner lead has a step portion so that the die pad portion is formed at a lower position than the inner leads. The step portion is formed so as to be offset from a line of the end portions of the inner leads in the opposite direction of the semiconductor chip, so an arbitrary bonding wire can be kept apart from the step portion. According to this invention, a semiconductor device which can properly prevent contact between the step portion and the bonding wire to improve the reliability, and a lead frame applicable to this semiconductor device can be provided.

REFERENCES:
patent: 5386141 (1995-01-01), Liang et al.
patent: 5530281 (1996-06-01), Groover Et Sl
patent: 5592019 (1997-01-01), Ueda et al.
patent: 5629559 (1997-05-01), Muyahara
patent: 5637915 (1997-06-01), Sato et al.
patent: 5648681 (1997-07-01), Takashima et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Lead frame and a semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Lead frame and a semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Lead frame and a semiconductor device will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-98555

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.