4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package

Ying-Tsai Yeh

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active

Chip on glass package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Chip package and package process thereof

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Contact sensor package structure

Electricity: circuit makers and breakers – Capacitive switch
Reexamination Certificate

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Sensor chip packaging structure

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With window means
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2949495

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