Sensor chip packaging structure

Details Sensor chip packaging structure Sensor chip packaging structure

2007-03-06

2007-03-06

Ha, Nathan W. (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With window means

C257S254000

Reexamination Certificate

active

11163869

ABSTRACT:
A sensor chip for defining an exposed molding region is disclosed. The sensor chip includes a semiconductor chip and a metal dam bar protruding from the active surface of the semiconductor chip. The active surface of the semiconductor chip includes a sensing region and at least one bonding pad is disposed on the active surface. The metal dam bar separates the sensing region and the bonding pad to prevent contamination of the sensing region by the mold flash. Preferably, a step is formed on the periphery of the active surface of the semiconductor chip, such that the semiconductor chip includes a T-shaped profile. Additionally, the metal dam bar is extended to the step to form an enclosed ring thereby effectively defining an exposed molding region that contains the sensing region.

REFERENCES:
patent: 6401545 (2002-06-01), Monk et al.
patent: 6987312 (2006-01-01), Theuss
patent: 2002/0163601 (2002-11-01), Min et al.
patent: 2005/0259853 (2005-11-01), Miyai et al.
patent: 2005/0263836 (2005-12-01), Okada et al.

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