4. Electricity: measuring and testing
  5. Fault detecting in electric circuits and of electric components
  6. Of individual circuit component or element

Yian-Liang Kuo

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Apparatus and method for testing conductive bumps

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Reexamination Certificate

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Apparatus and method for testing conductive bumps

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Reexamination Certificate

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Heat spreader ball grid array (HSBGA) design for low-k...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Integrated circuit package bond pad having plurality of...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Solder mask removal method

Etching a substrate: processes – Gas phase etching of substrate – Application of energy to the gaseous etchant or to the...
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Profile ID: LFUS-PAI-P-2916872

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