Solder mask removal method

Details Solder mask removal method Solder mask removal method

2006-07-25

2006-07-25

Ahmed, Shamim (Department: 1765)

Etching a substrate: processes

Gas phase etching of substrate

Application of energy to the gaseous etchant or to the...

C216S013000, C216S059000, C219S121610, C219S121700

Reexamination Certificate

active

07081209

ABSTRACT:
A printed circuit board has a circuit trace on it and a solder mask over the circuit trace. The solder mask is removed from the printed circuit board using an ultra violet laser, to expose the circuit trace without damaging the circuit trace. A failure analysis is performed on the circuit trace of the printed circuit board.

REFERENCES:
patent: 5626774 (1997-05-01), Paulus
patent: 6004734 (1999-12-01), Berg
patent: 6346678 (2002-02-01), Kono et al.
patent: 6756563 (2004-06-01), Gross et al.
patent: 6876689 (2005-04-01), Walling et al.
patent: 2001/0002728 (2001-06-01), Tsukada et al.
patent: 2003/0057515 (2003-03-01), Fillion et al.
VLOC (Subsidiary of II-VI Incorporated), “Yttrium Aluminum Garnet Laser Materials”, before Jul. 9, 2003.
Michelle D. Shinn, High Average Power Free-Electron Lasers—A New Laser Source For Materials Processing, Thomas Jefferson National Accelerator Facility, Newport News, VA, Aug. 2000.
Circuit Technology Center, “Techniques For Removing Solder Mask”, as found at mhtml:file//C:/WINNT/Temp/MXLibDir/Feature%20-%204%20Techniques%20for%20R. published 2001.

Affiliated with

Also associated with

Rating

Solder mask removal method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Solder mask removal method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Solder mask removal method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3558505