Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
Inventor
active
Double surface mount technology for electronic packaging
Meniscus-shape terminations for leadless electronic components
Optimized solder joints and lifter pads for improving the solder
Power module with silicon dice oriented for improved reliability
Standoff controlled interconnection
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Profile ID: LFUS-PAI-P-41613