Power module with silicon dice oriented for improved reliability

Details Power module with silicon dice oriented for improved reliability Power module with silicon dice oriented for improved reliability

1996-04-01

1998-04-07

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

257724, 257747, 257779, H01L 2334, H01L 2348

Patent

active

057367868

ABSTRACT:
A power module has a metallic base plate layer and a substrate layer that has a first metallic layer, a dielectric layer, and a second metallic layer. A solder layer thermally and electrically connects the second metallic layer to the base plate. A plurality of silicon dice are mounted to the first metallic layer of the substrate. The solder layer has a void development region which after a predetermined number of thermal cycles does not significantly increase. The silicon dice are oriented on the substrate layer so that the silicon dice are not aligned over the void development region corresponding to the useful life of the module. The metallic base plate may also be mounted to a heatsink through a thermal grease layer. The heatsink may comprise the outer covering of the power module.

REFERENCES:
patent: 3619734 (1971-11-01), Assour et al.
patent: 3982271 (1976-09-01), Olivieri et al.
patent: 5134463 (1992-07-01), Yamaguchi
patent: 5182628 (1993-01-01), Izawa et al.

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