Double surface mount technology for electronic packaging

Details Double surface mount technology for electronic packaging Double surface mount technology for electronic packaging

1993-11-12

1995-01-31

Ledynh, Bot

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361790, 174260, 257686, 257724, H05K 118

Patent

active

053863437

ABSTRACT:
A novel printed circuit board is disclosed. The printed circuit board has a high density of circuit components with lower circuit components residing within recesses in a printed wiring board and upper circuit components residing above the lower circuit components.

REFERENCES:
patent: 4631820 (1986-12-01), Harada et al.
patent: 4742431 (1988-05-01), Igarashi
patent: 4883428 (1989-11-01), Tonooka
patent: 4959750 (1990-09-01), Cnyrim et al.
patent: 4999740 (1991-03-01), Ilardi et al.
patent: 5083236 (1992-01-01), Chason et al.
IBM Technical Disclosure Bulletin, vol. 24, No. 4, Sep. 1981, "Structures for Connecting Electrical Circuits on Bubble Chips to I/O Pins on Bubble Chip Carriers".

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