Standoff controlled interconnection

Details Standoff controlled interconnection Standoff controlled interconnection

1997-01-16

1999-08-03

Heinrich, Samuel M.

Metal fusion bonding

Process

Plural joints

228175, 228246, 361770, 361771, B23K 3102, B23K 3524, B23K 3514

Patent

active

059313714

ABSTRACT:
A method for joining a component to a substrate applies a base solder portion to the substrate and provides a standoff solder portion in the base solder portion. The standoff solder portion has a higher melting temperature than the base solder portion and a height which substantially corresponds to a desired standoff height between the component and the substrate. The component is positioned on the standoff solder portion and the base solder portion is melted under reflow conditions to form a solder joint between the component and the substrate. This joint substantially encapsulates the standoff solder portion, wherein the reflow conditions create a dendritic structure between the base solder portion and the standoff solder portion.

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