Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
Inventor
active
Chip package having asymmetric molding
Chip package having with asymmetric molding and turbulent...
Chip-stacked package structure having leadframe with...
High frequency IC package and method for fabricating the same
Stacked chip package structure with leadframe having inner...
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Profile ID: LFUS-PAI-P-3188668