4. Textiles: manufacturing
  5. Warp preparing or handling

Wolfgang Sauter

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Chip dicing

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate

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Chip dicing

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate

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Chip dicing

Semiconductor device manufacturing: process – Semiconductor substrate dicing
Reexamination Certificate

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Chip dicing

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate

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Chip underfill in flip-chip technologies

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1998229

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