William Y. Jan

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Article comprising a mechanically compliant bump

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

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Controllable semiconductor modulator having interleaved contacts

Patent

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Method for depositing aluminum layers on insulating oxide substr

Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering
Patent

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Method for preparation of silicon nitride gallium diffusion barr

Fishing – trapping – and vermin destroying
Patent

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Method of making a mechanically compliant bump

Coating processes – Electrical product produced – Metal coating
Reexamination Certificate

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Profile ID: LFUS-PAI-P-473890

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