4. Metal working
  5. Method of mechanical manufacture
  6. Electrical device making

William P. Dugan

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Bump circuits on tape utilizing chemical milling

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent

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Double-cell electroplating apparatus and method

Chemistry: electrical and wave energy – Processes and products
Patent

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Electroformed and chemical milled bumped tape process

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent

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Electroformed chemically milled probes for chip testing

Metal working – Method of mechanical manufacture – Electrical device making
Patent

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Electroformed chemically milled probes for chip testing

Electricity: measuring and testing – Measuring – testing – or sensing electricity – per se – With rotor
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Profile ID: LFUS-PAI-P-170395

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