Electroformed chemically milled probes for chip testing

Metal working – Method of mechanical manufacture – Electrical device making

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204 15, H01K 310

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048782947

ABSTRACT:
A method for manufacturing a probe test structure for microcircuits utilizes a multiple coating method in conjunction with a novel double-cell electroplating apparatus having a relatively high-resistance ion path between the cells. Photoresist is applied to both sides of a copper foil, copper posts are electroformed onto selected areas of one side of the foil through image hole patterns, the remaining photoresist is stripped away, polyimide prepreg is laminated to the post side of the foil, the copper posts are exposed by sanding, photoresist is reapplied to both sides of the sanded remainder, additional copper is electroformed on each post through image hole patterns in the post side of the photoresist, the foil on the side opposite the posts is chemically milled to provide leads integral with each post using appropriate masking techniques and, finally, all of the remaining photoresist is removed to leave the desired test probe set. In a second embodiment, nickel plating is added over the copper to acheive selective etching, permitting processing of both sides of the copper foil simultaneously.

REFERENCES:
patent: 2734150 (1956-02-01), Beck
patent: 2961746 (1960-11-01), Lyman
patent: 3324014 (1967-06-01), Modjeska
patent: 3447960 (1969-06-01), Tonozzi
patent: 3462349 (1969-08-01), Gorgenyi
patent: 3716907 (1973-02-01), Anderson
patent: 3761309 (1973-09-01), Schmitter et al.
patent: 3901770 (1975-08-01), Littwin
patent: 3904461 (1975-09-01), Estep et al.
patent: 3993515 (1976-11-01), Reichert
patent: 3997963 (1976-12-01), Riseman
patent: 4005472 (1977-01-01), Harris et al.
patent: 4067104 (1978-01-01), Tracy
patent: 4125310 (1978-11-01), Reardon, II
patent: 4125441 (1978-11-01), Dugan
patent: 4139434 (1979-02-01), Dugan
patent: 4141782 (1979-02-01), Dugan et al.
patent: 4221047 (1980-09-01), Narken et al.
patent: 4236777 (1980-12-01), Merlina et al.
patent: 4293637 (1981-10-01), Hatada et al.
patent: 4334349 (1982-06-01), Aoyama et al.
patent: 4649338 (1987-03-01), Dugan
IBM Technical Disclosure Bulletin, vol. 22, No. 5, Oct., 1979, pp. 1821-1822.
IBM Technical Disclosure Bulletin, vol. 21 No. 6, Nov. 1978, pp. 2553-2554.
IBM Technical Disclosure Bulletin, vol. 11, No. 5, Oct. 1968, p. 506.

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