Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1978-01-30
1979-02-27
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
29625, 96 362, 156659, 156661, 156666, 156668, 156901, C23F 102, B29C 1708, H01L 21306, H01L 21312
Patent
active
041417828
ABSTRACT:
Carriers forming strips for semiconductor integrated circuit chips. The carrier consists basically of a flexible tape, such as a polyimide. A conductive sheet, such as a copper sheet, is initially prepared to form a lead circuit on one surface and a bump circuit on the other. This metal sheet may be gold plated. Subsequently, a layer of polyimide is applied to the lead circuit side and both the polyimide sheet and the opposite bump circuit are covered with a metal sheet, such as copper. A photoresist layer is put over the copper and is suitably illuminated and developed to provide apertures through which the copper can be etched to expose the polyimide sheet. This takes place over the windows or openings adjacent the bumps for the application of a heat ram as well as for the sprocket holes used for precisely aligning the carrier with the to-be-associated semiconductor chips. Finally, openings may also be provided to separate adjacent carrier strips from each other. The exposed polyimide layer is now removed by chemical milling. Subsequently the previously applied outer copper sheets are removed as by etching.
REFERENCES:
patent: 3816198 (1974-06-01), LaCombe et al.
patent: 4052787 (1977-10-01), Shaheen et al.
patent: 4057459 (1977-11-01), Mitterhummer et al.
Dugan William P.
Phillips Eugene
Bissell Henry M.
General Dynamics Corporation
Johnson Edward B.
Powell William A.
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