Double-cell electroplating apparatus and method

Details Double-cell electroplating apparatus and method Double-cell electroplating apparatus and method

1988-05-23

1990-06-19

Tung, T.

Chemistry: electrical and wave energy

Processes and products

204237, 204238, 204239, 204269, C25B 1508, C25D 502

Patent

active

049351095

ABSTRACT:
An apparatus and method are described for electroplating surfaces. The apparatus reduces the anode effect on current density, and is therefore particularly suitable for copper or nickel plating of fine-line metal circuitry. Current density regulation is achieved by separating the anode and cathode into separate cells and achieving electrolyte communication between the cells by providing a relatively high-impedance ion path. The preferred embodiment includes a siphon tube as an ion path and a pump and filter in a separate path to maintain electrolyte circulation between the cells.

REFERENCES:
patent: 883756 (1908-04-01), Steiner
patent: 1840105 (1932-01-01), Kean
patent: 2162942 (1939-06-01), De Rohden
patent: 2761831 (1956-09-01), Luechauer
patent: 2796395 (1957-06-01), Roberts
patent: 2828256 (1958-03-01), Gempe
patent: 3954569 (1976-05-01), Vanderveer et al.
Webster's Seventh New Collegiate Dictionary, 1963, p. 813.

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