Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1988-05-23
1989-11-07
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
29827, 156652, 156656, 1566591, 1566611, 156150, 156645, 156634, 156902, 204 3, 204 15, 357 70, 361421, 437220, 430313, 430314, 430318, C23F 102, B44C 122, C03C 1500, C03C 2506
Patent
active
048789909
ABSTRACT:
A process for producing a copper lead frame tape in which the individual fingers of the lead frame are provided with gold plated bumps. A copper foil is provided with dry film photoresist on both sides and is initially processed to provide openings in one side of the resist for electroforming of the end products directly on the copper foil. Further processing produces openings on the other resist side in locations other than opposite the first resist side bumps whereby a following chemical milling of the exposed opposite side copper yields a plurality of fingers, each consisting of an integral bump/copper foil arrangement. The electroforming step is made possible by a novel double-cell electroplating method in which a relatively high-impedance ion path connects the two cells. Bump heights of as much as 0.0013 inch or greater are produced by the disclosed process, with uniformly excellent quality.
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Dugan William P.
Rivas Grace A.
Samudrala Rama P.
Bissell H.
Carroll Leo R.
General Dynamics Corp. Pomona Division
Powell William A.
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