4. Optics: measuring and testing
  5. Inspection of flaws or impurities
  6. Surface condition

William Mark Hiatt

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Method and apparatus for processing a semiconductor wafer on a r

Optics: measuring and testing – Inspection of flaws or impurities – Surface condition
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Methods of packaging microelectronic imaging devices

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Having light transmissive window
Reexamination Certificate

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Microelectronic device packages and methods for controlling...

Semiconductor device manufacturing: process – Having diamond semiconductor component
Reexamination Certificate

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Microelectronic device packages and methods for controlling...

Semiconductor device manufacturing: process – Having diamond semiconductor component
Reexamination Certificate

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Microelectronic device packages and methods for controlling...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

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