Semiconductor device manufacturing: process – Having diamond semiconductor component
Reexamination Certificate
2005-10-11
2008-12-30
Menz, Laura M (Department: 2813)
Semiconductor device manufacturing: process
Having diamond semiconductor component
C438S106000, C438S107000
Reexamination Certificate
active
07470563
ABSTRACT:
A microelectronic package and method for forming such a package. In one embodiment, the package can include a microelectronic substrate having first connection sites, and a support member having second connection sites and third connection sites, with the third connection sites accessible for electrical coupling to other electrical structures. A plurality of electrically conductive couplers are connected between the first connection sites and the second connection sites, with neighboring conductive couplers being spaced apart to define at least one flow channel. The at least one flow channel is in fluid communication with a region external to the microelectronic substrate. The generally non-conductive material can be spaced apart from the support member to allow the microelectronic substrate to be separated from the support member.
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Farnworth Warren
Hiatt William Mark
Coie LLP Perkins
Menz Laura M
Micro)n Technology, Inc.
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