Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate
2006-08-08
2006-08-08
Schillinger, Laura M. (Department: 2813)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
C257S790000, C257S783000
Reexamination Certificate
active
07087995
ABSTRACT:
A microelectronic package and method for forming such a package. In one embodiment, the package can include a microelectronic substrate having first connection sites, and a support member having second connection sites and third connection sites, with the third connection sites accessible for electrical coupling to other electrical structures. A plurality of electrically conductive couplers are connected between the first connection sites and the second connection sites, with neighboring conductive couplers being spaced apart to define at least one flow channel. The at least one flow channel is in fluid communication with a region external to the microelectronic substrate. The generally non-conductive material can be spaced apart from the support member to allow the microelectronic substrate to be separated from the support member.
REFERENCES:
patent: 5126829 (1992-06-01), Daikoku et al.
patent: 5249100 (1993-09-01), Satoh et al.
patent: 5251100 (1993-10-01), Fujita et al.
patent: 5515912 (1996-05-01), Daikoku et al.
patent: 5586004 (1996-12-01), Green et al.
patent: 5600203 (1997-02-01), Namikawa et al.
patent: 5677566 (1997-10-01), King et al.
patent: 5774334 (1998-06-01), Kawamura et al.
patent: 5864178 (1999-01-01), Yamada et al.
patent: 5866953 (1999-02-01), Akram et al.
patent: 5891753 (1999-04-01), Akram
patent: 5898224 (1999-04-01), Akram
patent: 5917231 (1999-06-01), Kasai
patent: 5920768 (1999-07-01), Shintai
patent: 5933713 (1999-08-01), Farnworth
patent: 5959363 (1999-09-01), Yamada et al.
patent: 5980977 (1999-11-01), Deng et al.
patent: 5989941 (1999-11-01), Wensel
patent: 6037658 (2000-03-01), Brodsky et al.
patent: 6046496 (2000-04-01), Corisis et al.
patent: 6048744 (2000-04-01), Corisis et al.
patent: 6048755 (2000-04-01), Jiang et al.
patent: 6049125 (2000-04-01), Brooks et al.
patent: 6072233 (2000-06-01), Corisis et al.
patent: 6075288 (2000-06-01), Akram
patent: 6081429 (2000-06-01), Barrett
patent: 6084300 (2000-07-01), Oka
patent: 6097087 (2000-08-01), Farnworth et al.
patent: 6107122 (2000-08-01), Wood et al.
patent: 6118179 (2000-09-01), Farnworth et al.
patent: 6122171 (2000-09-01), Akram et al.
patent: 6129955 (2000-10-01), Papathomas et al.
patent: 6148509 (2000-11-01), Schoenfeld et al.
patent: 6153924 (2000-11-01), Kinsman
patent: 6159764 (2000-12-01), Kinsman et al.
patent: 6163956 (2000-12-01), Corisis
patent: 6180504 (2001-01-01), Farnworth et al.
patent: 6180527 (2001-01-01), Farnworth et al.
patent: 6180696 (2001-01-01), Wong et al.
patent: 6208519 (2001-03-01), Jiang et al.
patent: 6215175 (2001-04-01), Kinsman
patent: 6252772 (2001-06-01), Allen
patent: 6303981 (2001-10-01), Moden
patent: 6310288 (2001-10-01), Moden
patent: 6310390 (2001-10-01), Moden
patent: 6314639 (2001-11-01), Corisis
patent: 6326242 (2001-12-01), Brooks et al.
patent: 6326687 (2001-12-01), Corisis
patent: 6329222 (2001-12-01), Corisis et al.
patent: 6337513 (2002-01-01), Clevenger et al.
patent: 6344976 (2002-02-01), Schoenfeld et al.
patent: 6351384 (2002-02-01), Daikoku et al.
patent: 6373142 (2002-04-01), Hoang
patent: 6459581 (2002-10-01), Newton et al.
patent: 6673649 (2004-01-01), Hiatt et al.
patent: 6790473 (2004-09-01), Papathomas et al.
patent: 6794225 (2004-09-01), Manepalli et al.
patent: 6908789 (2005-06-01), Lebonheur et al.
patent: 2004/0101991 (2004-05-01), Hiatt et al.
patent: 08-335774 (1996-12-01), None
patent: WO 99/21226 (1999-04-01), None
Farnworth Warren
Hiatt William Mark
Micro)n Technology, Inc.
Schillinger Laura M.
LandOfFree
Microelectronic device packages and methods for controlling... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Microelectronic device packages and methods for controlling..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Microelectronic device packages and methods for controlling... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3669034