Methods of packaging microelectronic imaging devices

Details Methods of packaging microelectronic imaging devices Methods of packaging microelectronic imaging devices

2004-04-27

2009-12-15

Garber, Charles D. (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Having light transmissive window

C438S064000, C438S065000, C438S066000, C438S067000, C438S068000, C257SE21001

Reexamination Certificate

active

07632713

ABSTRACT:
Microelectronic imaging devices and methods of packaging microelectronic imaging devices are disclosed herein. In one embodiment, the microelectronic imaging devices include an interposer substrate and a plurality of imager units coupled to the interposer substrate. The interposer substrate includes a plurality of openings and a plurality of contact arrays proximate to corresponding openings. The individual imager units include a microelectronic die with an image sensor and a plurality of bond-pads electrically coupled to the image sensor. The image sensors are aligned with corresponding openings on the interposer substrate, and the bond-pads are electrically coupled to corresponding contacts on the interposer substrate.

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