Method and apparatus for processing a semiconductor wafer on a r

Details Method and apparatus for processing a semiconductor wafer on a r Method and apparatus for processing a semiconductor wafer on a r

1997-08-18

1999-10-05

Rosenberger, Richard A.

Optics: measuring and testing

Inspection of flaws or impurities

Surface condition

G01N 2188

Patent

active

059633158

ABSTRACT:
The present disclosure is a method for in situ monitoring of backside contamination on a semiconductor wafer (120) between processing steps which are performed in a multi-chamber tool (500). In a first form, a laser source (220) and a detector (210) are mounted on a robotic arm (110, 111), or within a semiconductor processing tool (500). The laser (220) and detector (210) move along with the robotic arm (110) as the robotic arm (110) shuffles the wafer (120) between processing carriers (610-650) and chambers (510-540). While in transit the backside of the semiconductor wafer (120) is scanned by a laser beam (221), whereby contamination is detected by a detector (210). The laser (220) and detector (210) then scan the backside of the wafer (120) while the robotic arm (110) is in transit and/or while the robotic arm (110) is stationary in the processing sequence. The absolute particle count and differential/incremental particulate counts are calculated on a chamber-by-chamber, and wafer-by-wafer basis, using a data processor (230).

REFERENCES:
patent: 4895446 (1990-01-01), Maldari et al.
patent: 5274434 (1993-12-01), Morioka et al.
patent: 5710624 (1998-01-01), Utamura
patent: 5780204 (1998-07-01), La et al.

Affiliated with

Also associated with

Rating

Method and apparatus for processing a semiconductor wafer on a r does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for processing a semiconductor wafer on a r, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for processing a semiconductor wafer on a r will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1177977