Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Configuration or pattern of bonds
Inventor
active
Electrically and thermally enhanced package using a separate sil
Method of packing an IC die in a molded plastic employing an ult
Multi-purpose bond pad test die
Staggered pad array
Universal test die and method for fine pad pitch designs
No associations
LandOfFree
William K. Shu does not yet have a rating. At this time, there are no reviews or comments for this inventor.
If you have personal experience with William K. Shu, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and William K. Shu will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-P-326735