Multi-purpose bond pad test die

Details Multi-purpose bond pad test die Multi-purpose bond pad test die

1990-11-16

1992-10-06

Wieder, Kenneth A.

Electricity: measuring and testing

Measuring, testing, or sensing electricity, per se

With rotor

357 65, 357 68, 437 8, G01R 3100, G01R 3102

Patent

active

051535076

ABSTRACT:
A novel test die is disclosed for use in conjunction with a semiconductor assembly machine or process. The test die includes a plurality of sets of bond pads having different bond pad pitches which permits testing of those pitches with use of a single die. Bond pads suitable for array bonding and having different bond pad pitches are also disclosed. Electrical connections are provided between bond pads and permit detection of open and short circuits or other circuit defects. A staggered arrangement of bond pads permits bond pads to be packed more densely on the die. A method for fabricating a wafer having a plurality of bond pads which form a repeating pattern is given. The patterned wafer may be cut to form a test die having bond pads which are positioned to provide bond pad pitches as required by a user.

REFERENCES:
patent: 3039604 (1962-06-01), Bickel et al.
patent: 3715242 (1973-02-01), Daniel
patent: 4628144 (1986-12-01), Burger
patent: 4778771 (1988-10-01), Hiki
patent: 4833513 (1989-05-01), Sasaki
patent: 4881029 (1989-11-01), Kawamura
patent: 4893168 (1990-01-01), Takahashi
patent: 4959706 (1990-09-01), Cusack et al.
patent: 4999700 (1991-03-01), Dunaway et al.

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