William H. Price

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Method for forming distributed barrier compound semiconductor co

Fishing – trapping – and vermin destroying
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Module input-output pad having stepped set-back

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Solder wettable contact – lead – or bond
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Process for corrosion free multi-layer metal conductors

Fishing – trapping – and vermin destroying
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Robust interconnect structure

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Thermally stable low resistance contact

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Profile ID: LFUS-PAI-P-332455

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