Process for corrosion free multi-layer metal conductors

Details Process for corrosion free multi-layer metal conductors Process for corrosion free multi-layer metal conductors

1992-12-29

1995-06-27

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

148DIG105, H01L 2144

Patent

active

054279836

ABSTRACT:
A thin-layer metallization structure in which the final gold layer is deposited by evaporation with the surface onto which it is evaporated maintained at an elevated temperature. By evaporating the uppermost gold layer of the structure at an elevated substrate temperature, the gold atoms have a higher mobility, causing the deposited gold to spread over the edge of the structure and cover the otherwise exposed edges, including the edge at the copper interface.

REFERENCES:
patent: 3721841 (1973-03-01), Wilson
patent: 4077854 (1978-03-01), Estep et al.
patent: 4309460 (1982-01-01), Singh et al.
patent: 4355456 (1982-11-01), Harnagel et al.
patent: 4396900 (1983-08-01), Hall
patent: 4830723 (1989-05-01), Galvagni et al.
patent: 4835593 (1989-05-01), Arnold et al.
patent: 5019531 (1991-05-01), Awaya et al.
patent: 5047832 (1991-09-01), Tonai
patent: 5139610 (1992-08-01), Dunaway et al.
patent: 5232872 (1993-08-01), Ohba
patent: 5266522 (1993-11-01), Digiacomo et al.
Movchan et al. "Study of the Structure and Properties of Thick Vacuum Condensates . . . " Fiz. Metal Metalloved, vol. 28 No. 4, pp. 653-660, 1969.
Grovenor et al. "The Development of Grain Structure During Growth of Metallic Films", Acta Metall. vol. 32, No. 5, pp. 773-781, 1984.
Chisholm et al. "Low Energy Interfaces in Thin Film Structures", Transtech Publications, 1988, p. 201.

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