Module input-output pad having stepped set-back

Details Module input-output pad having stepped set-back Module input-output pad having stepped set-back

1994-04-25

1996-01-09

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Solder wettable contact, lead, or bond

257781, 257751, H01L 2348, H01L 2352, H01L 2940

Patent

active

054831059

ABSTRACT:
A ceramic substrate pad used for establishing brazed connection between a pin and the substrate in the packaging of microelectronic semiconductor circuit chip. The pad is characterized by a stepped setback in the upper surface thereof which setback is oxidized to prevent wetting by the brazing alloy which bonds the pin to the pad. Stresses attributable to the brazing are isolated from the setback area and thus have reduced effect in causing cracking at the edges of the pad-substrate interface.

REFERENCES:
patent: 4672739 (1987-06-01), Churchwell et al.
patent: 4835593 (1989-05-01), Arnold et al.
patent: 4970570 (1990-11-01), Agarwala et al.
patent: 5036383 (1991-07-01), Mori
patent: 5060051 (1991-10-01), Usuda
patent: 5175609 (1992-12-01), DiGiacomo et al.
patent: 5367195 (1994-11-01), DiGiacomo et al.
IBM Technical Disclosure Bulletin, R. W. Noth, "Solder Bond", vol. 17, No. 8, Jan. 1975, p. 2214.
IBM Research Disclosure, Palmateer, et al., "Improving Pin Pull Strength", Apr. 1987, No. 276.

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