4. Adhesive bonding and miscellaneous chemical manufacture
  5. Delaminating processes adapted for specified product
  6. Delaminating in preparation for post processing recycling step

William H. Lytle

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Activation plate for electroless and immersion plating of...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Adjustable plating cell for uniform bump plating of semiconducto

Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Coating selected area
Patent

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Apparatus and method for cold cross-sectioning of soft...

Abrading – Tool support for flexible-member tool – Having magnetic or suction tool holding means
Reexamination Certificate

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Backside metallization scheme for semiconductor devices

Stock material or miscellaneous articles – All metal or with adjacent metals – Composite; i.e. – plural – adjacent – spatially distinct metal...
Patent

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Bonding structure for an electronic device

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
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Profile ID: LFUS-PAI-P-580516

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