Adjustable plating cell for uniform bump plating of semiconducto

Details Adjustable plating cell for uniform bump plating of semiconducto Adjustable plating cell for uniform bump plating of semiconducto

1994-02-25

1995-02-21

Valentine, Donald R.

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Coating selected area

205148, 205266, 204224R, 204238, 204275, 204284, 204292, C25D 712, C25D 1706, C25D 1712

Patent

active

053912853

ABSTRACT:
An apparatus plates metal bumps of uniform height on one surface of a semiconductor wafer (32). A plating tank (12) contains the plating solution. The plating solution is filtered (16) and pumped (14) through an inlet (22) to an anode plate (24) within plating cell (20). The anode plate has a solid center area to block direct in-line passage of the plating solution, and concentric rings of openings closer to its perimeter to pass the plating solution. The distance between the inlet and the anode plate is adjustable with supports to create a uniform flow of the plating solution to the surface of the semiconductor wafer for uniform plating of the array of metal bumps (30). The plating cell contains an adjustable sidewall extension (26) to set the proper distance between the anode plate and the semiconductor wafer.

REFERENCES:
patent: 3536594 (1970-10-01), Pritchard
patent: 4304641 (1981-12-01), Grandia et al.
patent: 4339319 (1982-07-01), Aigo
patent: 4340449 (1982-07-01), Srinivasan et al.
patent: 4466864 (1984-08-01), Bacon et al.
patent: 4906341 (1990-03-01), Yamakawa et al.
patent: 5000827 (1993-03-01), Schuster et al.
patent: 5228966 (1993-07-01), Murata

Affiliated with

Also associated with

Rating

Adjustable plating cell for uniform bump plating of semiconducto does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Adjustable plating cell for uniform bump plating of semiconducto, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Adjustable plating cell for uniform bump plating of semiconducto will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1927997