Bonding structure for an electronic device

Details Bonding structure for an electronic device Bonding structure for an electronic device

1996-05-29

1999-06-15

Arroyo, Teresa M.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

257777, 257780, 257783, H01L 2348, H01L 2352, H01L 2940

Patent

active

059125101

ABSTRACT:
A bonding structure (10) is formed between a first component (12) and a second component (11) to form a semiconductor device. The bonding structure (10) comprises a bump (24) that has a pedestal region (22) and a crown region (23). The crown region (23) is anchored into a well region (13) of a conductive material (16) that is formed on the second component (11).

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patent: 5422516 (1995-06-01), Hosokawa et al.
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patent: 5554887 (1996-09-01), Sawai et al.
patent: 5600180 (1997-02-01), Kusaka et al.
patent: 5619071 (1997-04-01), Myers et al.

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