4. Boots, shoes, and leggings

William F. Shutler

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High bandwidth 3D memory packaging technique

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Integrated thermoelectric cooling

Patent

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Intermediate memory array with a parallel port and a buffered se

Boots – shoes – and leggings
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Jogging structure for wiring translation between grids with...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Jogging structure for wiring translation between grids with...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Profile ID: LFUS-PAI-P-33575

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