1990-02-28
1991-07-16
Larkins, William D.
357 74, 357 80, 357 68, 357 87, H01L 2338
Patent
active
050328972
ABSTRACT:
A thermoelectrically cooled integrated circuit package including an insulative module which defines a cavity, a thermoelectric cooler within the cavity, and an integrated circuit chip connected to the thermoelectric cooler, thus providing an integrated circuit package in which the integrated circuit package itself dissipates thermal energy generated by the integrated circuit chip.
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Mansuria Mohanlal S.
Mosley Joseph M.
Musa Richard D.
Shutler William F.
Tuozzolo Vito J.
International Business Machines Corp.
Larkins William D.
Russell Daniel N.
Terrile Stephen A.
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