4. Metal working
  5. Method of mechanical manufacture
  6. Electrical device making

Wen-chou V. Wang

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Apparatus for cooling semiconductor chips in multichip modules

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent

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Functional substrates for packaging semiconductor chips

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

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Functional substrates for packaging semiconductor chips

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics
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Interconnect capacitors

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor
Patent

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Interconnect carriers having high-density vertical connectors an

Electrical connectors – Including elastomeric or nonmetallic conductive portion – Adapted to be sandwiched between preformed panel circuit...
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Profile ID: LFUS-PAI-P-569926

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