Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics
Patent
1992-08-07
1995-01-17
Crane, Sara W.
Active solid-state devices (e.g., transistors, solid-state diode
Integrated circuit structure with electrically isolated...
Passive components in ics
257686, 257691, 257724, 257737, 257738, H01L 2702, H01L 2348, H01L 2316, H01L 2944
Patent
active
053828275
ABSTRACT:
A semiconductor chip carrier has a first substrate and at least one second substrate. The first substrate is for carrying at least one semiconductor chip of integrated circuits. The first substrate has predetermined functional elements for connection to the integrated circuits of the at least one semiconductor chip. Such a second substrate is directly coupled to the first substrate. The second substrate is capable of being independently created and has predetermined electrical functional elements for connection to the integrated circuits of the semiconductor chip. The electrical functional elements of each second substrate are of one type and are different than the electrical functional elements of the other second substrates and the first substrate.
The second substrate has a top interconnect layer, a bottom interconnect layer, and a plurality of intra-substrate connectors (or through-hole connectors), where the top interconnect layer and the bottom interconnect layer have substantially identical patterns of electrical contacts. The electrical contacts may be deformable bumps, solder bumps, elastomer bumps, or gold bumps.
The electrical functional elements are electrically passive circuits, such as capacitors, resistors, or electrical signal conductors. Such a second substrate may include power supply circuits.
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patent: 5032896 (1991-07-01), Little et al.
S. Magdo, IBM Technical Disclosure Bulletin, "Low Inductance Module", Oct. 1978, New York, vol. 21, No. 5, pp. 1895-1897.
L. S. Goldman, IBM Technical Disclosure Bulletin, "Universal Electronic Package", Nov. 1984, New York, vol. 27, No. 6, pp. 3335-3336.
Chou William T.
Wang Wen-chou V.
Crane Sara W.
Fujitsu Limited
Wallace Valencia M.
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