Interconnect capacitors

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor

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Details

361303, 361766, 29 2542, H01G 114

Patent

active

054042658

ABSTRACT:
A bypass capacitor for use with an integrated circuit module, and method of making the same, are shown. The integrated circuit module comprises an integrated circuit "chip" mounted in opposing relationship to a carrier substrate and having a plurality of interconnects, such as solder bumps or wire interconnects, for providing signal lines and supplying power to the chip. Some of the interconnects are, instead, used to form capacitors such that bypass capitance is placed in close proximity to the chip, while not using up valuable real estate on the chip or on the carrier substrate. Various embodiments of such bypass capacitors are shown.

REFERENCES:
patent: 3191098 (1965-06-01), Fuller
patent: 3962713 (1976-06-01), Kandall et al.
patent: 4153988 (1979-05-01), Doo
patent: 4322778 (1982-03-01), Barbour et al.
patent: 4420790 (1983-12-01), Golke et al.
patent: 4505029 (1985-03-01), Owyang et al.
patent: 4598307 (1986-07-01), Wakabayashi et al.
patent: 4617586 (1986-10-01), Cuvilliers et al.
patent: 4670770 (1987-06-01), Tai
patent: 4714952 (1987-12-01), Takekawa
patent: 4744008 (1988-05-01), Black et al.
patent: 4945399 (1990-07-01), Brown et al.
patent: 5001545 (1991-03-01), Kalfus
patent: 5016087 (1991-05-01), Haug et al.
patent: 5049979 (1991-09-01), Hashemi et al.
patent: 5086370 (1992-02-01), Yasaitis
patent: 5095402 (1992-03-01), Hernandez et al.
patent: 5148266 (1992-09-01), Khandros
Dhong, et al., "Method of Increasing On-Chip VDD Decoupling Capacitiance Using a Shielded Micro-Strip Structure, " IBM Technical Disclosure Bulletin, vol. 34, No. 8, Jan. 1992, pp. 59-60.
Gruber, et al., "Direct Capacitor Attachment for Logic Chips, " IBM Technical Disclosure Bulletin, vol 33, No. 3A, Aug. 1990, pp. 229-231.
Fernandez, et al., "Leadless Decoupling Capacitor Fabricated on Wafer Backsie," IBM Technical Disclosure Bulletin, vol. 32, No. 3A, Aug. 1989, pp. 403-404.
Davis, et al., "Corrugated Capacitor Structure and Process,"IBM Technical Disclosure Bulletin, vol. 30, No. 3, Aug. 1987, pp. 1304-1305.
Gerstenberg, "Thin Film Capacitors," Handbook of Thin Film Technology, 1970, pp. 19-17-19-23.

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