4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead

Wei-Cheng Wu

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Differential sensing and TSV timing control scheme for 3D-IC

Electronic digital logic circuitry – Interface – Current driving
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High frequency flip chip package process of polymer...

Textiles: ironing or smoothing – Ironing tables – Combined
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MEMS device and method of making the same

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead
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Vertical transmission line structure that includes bump...

Wave transmission lines and networks – Coupling networks – With impedance matching
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Profile ID: LFUS-PAI-P-2239050

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