Vertical transmission line structure that includes bump...

Details Vertical transmission line structure that includes bump... Vertical transmission line structure that includes bump...

2011-05-10

2011-05-10

Lee, Benny (Department: 2817)

Wave transmission lines and networks

Coupling networks

With impedance matching

C333S260000, C257S664000, C257S728000

Reexamination Certificate

active

07940143

ABSTRACT:
A vertical transmission structure for high frequency transmission lines includes a conductive axial core and a conductive structure surrounding the conductive axial core. The vertical transmission structure is applied to a high-frequency flip chip package for reducing the possibility of underfill from coming in contact with the conductive axial core.

REFERENCES:
patent: 6172497 (2001-01-01), Okumichi
patent: 6400241 (2002-06-01), Ulian et al.
patent: 6417747 (2002-07-01), Dearden et al.
patent: 2008/0246562 (2008-10-01), Sherrer et al.

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