High frequency flip chip package process of polymer...

Details High frequency flip chip package process of polymer... High frequency flip chip package process of polymer...

2009-08-26

2011-10-11

Blum, David S (Department: 2813)

Textiles: ironing or smoothing

Ironing tables

Combined

C438S124000, C257SE21503, C257SE21511

Reexamination Certificate

active

08033039

ABSTRACT:
In a high frequency flip chip package process of a polymer substrate and a structure thereof, the structure is a one-layer structure packaged by a high frequency flip chip package process to overcome the shortcomings of a conventional two-layer structure packaged by the high frequency flip chip package process. The conventional structure not only incurs additional insertion loss and return loss in its high frequency characteristic, but also brings out a reliability issue. Thus, the manufacturing process of a ceramic substrate in the conventional structure still has the disadvantages of a poor yield rate and a high cost.

REFERENCES:
patent: 2008/0251940 (2008-10-01), Lee et al.
patent: 2010/0140772 (2010-06-01), Lin et al.
patent: 2011/0026232 (2011-02-01), Lin et al.

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