Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With semiconductor element forming part
Inventor
active
Chip-on-chip interconnections of varied characteristics
Chip-on-chip interconnections of varied characterstics
Electronic modules with integral sensor arrays
Endcap chip with conductive, monolithic L-connect for multichip
Highly integrated chip-on-chip packaging
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Profile ID: LFUS-PAI-P-65827