Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Patent
1996-01-29
1998-06-09
Ngo, Ngan V.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
257724, 257725, H01L 2302, H01L 2334
Patent
active
057639434
ABSTRACT:
An electronic module includes multiple stacked bare IC chips ("a stack") and a sensor assembly that is mechanically coupled to an end surface of the stack. Electrical connection between the sensor assembly and the stack is provided by a metallization layer disposed on a side-surface of the stack. Specifically, wiring of the sensor assembly extends to an edge surface thereof corresponding to the side-surface of the stack where it electrically connects to the side-surface wiring. The IC chips of the stack are similarly electrically connected to the side-surface wiring. Multiple sensors (e.g., CCD arrays) may be electrically and mechanically coupled to multiple surfaces of the stack for providing a, e.g., multi-view imaging module. Multiple electrical and mechanical options exist for the connection of sensors to stacks within electronic modules.
REFERENCES:
patent: 4403238 (1983-09-01), Clark
patent: 4660066 (1987-04-01), Reid
patent: 4706166 (1987-11-01), Go
patent: 4761681 (1988-08-01), Reid
patent: 5016138 (1991-05-01), Woodman
patent: 5021888 (1991-06-01), Kondou et al.
patent: 5051865 (1991-09-01), Kato
patent: 5055930 (1991-10-01), Nagasaki et al.
patent: 5347428 (1994-09-01), Carson et al.
patent: 5424920 (1995-06-01), Miyake
patent: 5432729 (1995-07-01), Carson et al.
patent: 5502667 (1996-03-01), Bertin et al.
patent: 5517059 (1996-05-01), Beilstein, Jr. et al.
patent: 5561593 (1996-10-01), Rotolante
patent: 5604377 (1997-02-01), Palagonia
patent: 5612570 (1997-03-01), Eide et al.
"Camera-In-A-Cube On Order By NASA" (Electronic Design, Mar. 20, 1995).
"Thomson 3-D Modules Ready for Prime Time" (Electronic Engineering Times, Jul. 25, 1994).
Baker Robert Grover
Bertin Claude Louis
Howell Wayne John
Mosley Joseph Michael
International Business Machines - Corporation
Ngo Ngan V.
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