Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Chip mounted on chip
Inventor
active
Integrated circuit package in package system
Integrated circuit package on package system
Integrated circuit package system including die stacking
Integrated circuit package system including die stacking
Integrated circuit package system including high-density...
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Profile ID: LFUS-PAI-P-2278829