Integrated circuit package system including die stacking

Details Integrated circuit package system including die stacking Integrated circuit package system including die stacking

2007-10-09

2009-11-17

Clark, Jasmine J (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Chip mounted on chip

C257S790000, C257S666000, C257S685000, C257S686000, C257SE25005, C257SE25006, C257SE25021, C257SE25027, C257SE23085

Reexamination Certificate

active

07619314

ABSTRACT:
An integrated circuit package system includes providing a leadframe, forming an aperture within the leadframe, mounting an integrated circuit package over or under the aperture, and mounting a die over the integrated circuit package with the die located within the aperture.

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