Integrated circuit package system including high-density...

Details Integrated circuit package system including high-density... Integrated circuit package system including high-density...

2005-10-29

2009-11-24

Garber, Charles D (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S113000, C438S118000, C438S126000, C438S127000, C257S738000, C257S782000, C257S783000, C257S787000, C257SE21001

Reexamination Certificate

active

07622325

ABSTRACT:
An integrated circuit package system including a high-density small footprint system-in-package with a substrate is provided. Passive components are mounted on the substrate. Solder separators are provided on the substrate, the solder separators having flattened tops at a predetermined height above the substrate. A die is supported on the solder separators above the substrate.

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