4. Stock material or miscellaneous articles
  5. All metal or with adjacent metals
  6. Composite; i.e., plural, adjacent, spatially distinct metal...

Tsuyoshi Honda

Inventor

Rate now
  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

Inventor

active

Adhesive composition and a method of using the same

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Processes of preparing a desired or intentional composition...
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Conductive resin compositions and electronic parts using the...

Compositions – Electrically conductive or emissive compositions – Elemental carbon containing
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Die bonding agent and a semiconductor device made by using...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Epoxy resin composition and semiconductor device

Stock material or miscellaneous articles – Composite – Of epoxy ether
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Epoxy resin composition, laminate film using the same, and...

Stock material or miscellaneous articles – All metal or with adjacent metals – Composite; i.e. – plural – adjacent – spatially distinct metal...
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

No associations

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Tsuyoshi Honda does not yet have a rating. At this time, there are no reviews or comments for this inventor.

If you have personal experience with Tsuyoshi Honda, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Tsuyoshi Honda will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-P-2091222

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.

Canada

 Charities
 Companies
 MP Candidates
 Patents
 Employee Salary Disclosure

World

 Places of the World
 Scientific Papers

United States

 Banks
 Companies
 Counties
 Patents
 Employee Salary Disclosure