Epoxy resin composition and semiconductor device

Details Epoxy resin composition and semiconductor device Epoxy resin composition and semiconductor device

2007-01-30

2007-01-30

Feely, Michael J. (Department: 1712)

Stock material or miscellaneous articles

Composite

Of epoxy ether

C438S127000, C523S445000, C523S451000, C525S476000

Reexamination Certificate

active

10771358

ABSTRACT:
An epoxy resin composition comprising (A) an epoxy resin, (B) a phenolic resin, (C) a curing accelerator, and (D) an effective flux component selected from among abietic acid, palustric acid, levopimaric acid and dihydroabietic acid is low volatile and exhibits improved wetting and adherent properties to solder balls. The epoxy resin composition is used to cover and encapsulate a semiconductor chip, especially as no-flow underfill material, forming a highly reliable semiconductor device.

REFERENCES:
patent: 3791027 (1974-02-01), Angelo et al.
patent: 6306792 (2001-10-01), Miyake et al.
patent: 6429238 (2002-08-01), Sumita et al.
patent: 2003/0164555 (2003-09-01), Tong et al.
Zhang et al, Study of Non-Anhydride Curing System for No-Flow Underfill Applications, IEEE Electronic Components and Technology Conference, 2001, p. 1474-1478.

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