4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Of specified material other than unalloyed aluminum

Tse-Yong Yao

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Apparatus for filling apertures in a film layer on a semiconduct

Coating apparatus – Gas or vapor deposition – Multizone chamber
Patent

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Barrier layer for electroplating processes

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Barrier layer for electroplating processes

Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Forming nonelectrolytic coating before depositing...
Reexamination Certificate

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Filling narrow apertures and forming interconnects with a...

Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering
Reexamination Certificate

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High pressure copper fill at low temperature

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Patent

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Profile ID: LFUS-PAI-P-339943

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